Briefly describe the steps of PCB circuit board production process

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The design process of printed circuit boards includes schematic design, electronic component database login, design preparation, block partitioning, electronic component configuration, configuration confirmation, wiring, and final inspection. In the process, no matter which process a problem is found, it must be returned to the previous process for reconfirmation or correction.
1. Design a schematic diagram according to the functional requirements of the circuit. The design of a schematic diagram is mainly based on the electrical performance of each component and the need for reasonable construction. Through this diagram, the important functions of the PCB circuit board and the relationships between various components can be accurately reflected. The design of the schematic is the first and crucial step in the PCB manufacturing process. The software commonly used for designing circuit schematics is PROTEl.
2. After the schematic design is completed, it is necessary to further package each component through PROTEL to generate and implement grids with the same appearance and size for the components. After modifying the component packaging, execute Edit/Set Preferencebrin 1 to set the packaging reference point on the first pin Then, you need to perform a Report/Component Rule check to set all the rules to be checked and make them OK At this point, the encapsulation has been established.
3. Formally generate PCB. After the network is generated, it is necessary to place the positions of each component according to the size of the PCB panel, and ensure that the leads of each component do not cross during placement. After placing the components, DRC inspection is performed to eliminate pin or lead crossing errors during wiring of each component. Once all errors are eliminated, a complete PCB design process is completed.

4. Use specialized copy paper to print out the designed PCB diagram through an inkjet printer, then press the side with the printed circuit diagram against the copper plate, and finally place it on a heat exchanger for thermal printing. Stick the circuit diagram ink on the copy paper to the copper plate at high temperature.
5. Prepare a solution for board making by mixing sulfuric acid and hydrogen peroxide in a ratio of 3:1. Then, place a copper plate containing ink stains into it and wait for about three to four minutes. After all areas on the copper plate, except for the ink stains, are corroded, remove the copper plate and rinse off the solution with clean water.
6. Punch holes. Use a drilling machine to drill holes on the copper plate where holes need to be left. After completion, introduce two or more pins of each matching component from the back of the copper plate, and then use a soldering tool to solder the components to the copper plate.
7. After the welding work is completed, a comprehensive testing of the entire circuit board is carried out. If any problems occur during the testing process, the location of the problem needs to be determined through the schematic diagram designed in the first step, and then re welding or replacement of components is carried out. After the test is successfully passed, the entire circuit board is completed.